Flame Retardant for CCL、FCCL、PCB、EMC
Description
Intro
GO YEN CHEMICAL INDUSTRIAL CO., LTD (GYC GROUP) as the biggest synthetic flame retardant and high technology chemical manufacturer. The core value of GYC is 『innovative』and『differentiation』which make GYC in the leading position for more than forty years. Therefore, GYC especially designed the flame retardant for electronic material which can be applied on Copper clad laminate(CCL), Flexible Copper Clad Laminate(FCCL),Printed circuit board (PCB) fields.
GYC have especially designed pioneer flame retardant for CCL、FCCL、PCB fields, which owns outstanding fireproof effect, excellent processing and dispersible abilities. Besides, GY-FR-P SERIES have been certificated by electronic factories: Welding resistance test (300 °C)：the average time can reach 30 mins、voltage resistance test：epoxy resin substrate can reach 3.0 KV.
Besides, GY-FR-P SERIES & GY-FR-OP SERIES can be applied on versatile high adding value electronic products such as printed circuit board, flexible copper clad laminates, copper clad laminate and aluminum substrate and etc. Furthermore, GY-FR-P SERIES & GY-FR-OP SERIES have passed the fireproof rule & ROHS certifications and adopted by several abroad and domestic electronic factories.
Advantages
- Provide electronic based products with outstanding fireproof effect.
- Soldering resistance can reach to over 300 °C
- Can be applied on fireproof CCL, FCCL, flexible and hard boards of PCB
- With excellent dispersible processing for all kinds of epoxy and phenolic resin
- Remarkable compatibility with most of high molecular and polymer
- Can be used in versatile reactive type resin and post addition flame retardant
- Can eliminate traditional brominated epoxy resin and toxic brominated flame retardant
- The manufacture process without antimony trioxide
- Long term fireproof ability
- Outstanding heat stability
- Can be applied on color and transparent fireproof electronic products
Properties
| Product | Flame Retardant for CCL、FCCL、PCB、EMC | |
| Grade | GY-FR-OP SERIES | GY-FR-P SERIES |
| Appearance | Fine powder | Liquid |
| Purity | 100% | 100% |
| Color | White | Transparent |
| Specific density | 1.8 | 1.27 |
| Dispersion | Excellent | excellent |
Usage and dosage
- Normally, high molecular material for original electronic substrate resin or electronic assemble are:
- Epoxy
- Polyimide，PI
- Phenolics
- Silicones
- The suggest dosage by GYC technical department is 10%~20%, customers can adjust depend on different kinds of resin
- Besides, technical staff can adjust formula according to the types of PCB,FLLC,CCL.
Applications
- Fireproof FCCL ,PCB and hard board.
- Fireproof heat dissipation substrate
- Fireproof substrate without adhesive
- Used in all kinds of epoxy fireproof application
- All kinds of Polyimide, Phenolic resin, silicones flame retard application
- Versatile electronic adhesive application such as hot melt glue, epoxy and adhesive
- Epoxy Molding Compound(EMC) flame retard
- LED,transistor
- Fireproof CCL, PCB flexible and hard boards
- All kinds of IC semi-conductor and packaging material
- All kinds of EMC electronic assembling
- Other special fireproof application
- Enhance the fireproof effect of electronic or packaging material and can overcome weak anti-aging and heat resistance of related material; GY-FR-P SERIES & GY-FR-OP SERIES can improve Anti-UV effect, with excellent dimension stability and low coefficient of expansion
- FR-CCL & FR-FCCL
- Can replace traditional low technical TBA and antimony trioxide
- FR-PCB and FR-Flexible-PCB
- Epoxy or acrylic resin based adhesive for fireproof substrate
- Other non-halogen, non-bromine and non-phosphorus grade–green eco-friendly substrate (FR-Flexible-PCB) application
- Can be applied on all kinds of water based and oil based resin
- Can be added in versatile thermal setting and thermal plastic resin
Package
- Powder : 25KG / BAG
- Liquid : 20KG /drum; 200KG / drum
