GOYENCHEM-CMP Chemical Mechanical Polishing additive
CMP technology is primarily applied in the polishing of optical lenses or other materials and silicon wafers. The CMP chemical-mechanical polishing process is an essential part of integrated circuit production. CMP involves chemically transforming or continuously grinding the wafer’s surface to make it thinner. During this process of surface transformation or thinning, grinding agents are added to the polishing pad to mechanically remove the thin film. The CMP slurry also plays a important role in the CMP process, impacting product efficiency and yield. Therefore, post-cutting wafers must undergo multiple chemical-mechanical polishing steps to make the wafer surface smoother and increase circuit density.
Description
Intro:
GO YEN CHEMICAL INDUSTRIAL CO., LTD. (GYC GROUP) is currently the largest manufacturer of functional specialty chemicals in Taiwan. Over the years, we have continuously pursued the development of products that meet market demands. We strive to understand our customers’ needs and assist them in research and development to create new products that solve their problems and meet their requirements.
CMP technology is primarily applied in the polishing of optical lenses or other materials and silicon wafers. The CMP chemical-mechanical polishing process is an essential part of integrated circuit production. CMP involves chemically transforming or continuously grinding the wafer’s surface to make it thinner. During this process of surface transformation or thinning, grinding agents are added to the polishing pad to mechanically remove the thin film. The CMP slurry also plays a important role in the CMP process, impacting product efficiency and yield. Therefore, post-cutting wafers must undergo multiple chemical-mechanical polishing steps to make the wafer surface smoother and increase circuit density.
Taking this responsibility seriously, GYC GROUP is committed to the development of CMP additives. Drawing from 40 years of experience in Nano material development, we have successfully developed Nano-grade CMP additives that can be widely used in various CMP applications.
Properties:
| GRADE | CMP additive |
| Appearance | transparent |
| pH | neutral |
testing data:
Testing optical lenses for contact lenses. GYC GROUP has developed this polishing additive, providing various grinding tools and material options. The table below shows a comparison of data from a major optical eyewear manufacturer before and after using our polishing additive.
| Contact lens Polishing Test | ||
| Non CMP added | 3% CMP Added | |
| Surface roughness measurement before polishing | 1 billion units | 1 billion units |
| Surface roughness measurement after polishing | 700 units | 300 units |
According to the chart, the general industry standard requires the surface roughness to be no more than 700 units after polishing. However, with the addition of our polishing additive, it can be reduced to 300 units. This data represents a significant leap forward in polishing effectiveness.
Features:
- No pungent smell
- Non-toxic
- Easy to add in various CMP processes
Application and recommended dosage:
- Apply to all kinds of CMP slurry
- the average dosage is 3%, (Fine-tuning the Materials for Visual Testing)
Packaging:
1KG/bottle