GY-PA-15&GY-PA-25 Fiberglass Modify Material

GY-PA-15&GY-PA-25 Fiberglass Modify Material improves the strength and robustness of the product. They replace the advantage of metal and improve heat stability, heat distortion point, and size stabilization (prevention of warp).

Description

Intro

GO YEN CHEMICAL INDUSTRIAL CO., LTD. (GYC GROUP) is a leading manufacturer of specialty chemicals in Asia. We devote ourselves to supplying products and solutions to our customers worldwide to satisfy and expand the market needs.

GOYENCHEM-PA series, fiberglass modify materials are Nylon 66+ Polyamide 66 + PA 6I/X (Nylon 66+Nylon 6I/X), improve strength and robustness of the product. They replace the advantage of metal and improve heat stability, heat distortion point, and size stabilization (prevention of warp). GOYENCHEM-PA series can be applied on the surface or casing of the board as a heat conductor/stabilizer, which is widely used in the process of extrusion and ejection. GOYENCHEM-PA series is suitable for automobiles, calorific electronics, machinery casing, etc.

 

Properties

GRADE GY-PA-15 GY-PA-25
Physical State                                                                                                                                  Granule Granule
Type Solid Solid
Color Black Black
Density g/cm3 1.24 1.32
Hardness Mpa 120
Melting Point OC 260 260
Water Absorbency

23OC %

2.8
Combustibility UL-94 HB HB

 

Mechanical Properties

GRADE GY-PA-15 GY-PA-25
Tensile Strength (Mpa) 16000 22000
Fracture Elongation (%) 2.5 2.5
Bending Strength (Mpa) 183 262
Bending Modulus (Mpa) 5169 6897
Impact Strength

Ft.lb/in(j/m)23oc

1.1 1.75
Heat Distortion Point

(1.82Mpa)

240 245
Coefficient of thermal expansion 1.0E 4 5

 

Electrical Performance

GRADE GY-PA-15 GY-PA-25
Dielectric Strength kV/mm 26 30
Volume Resistivity

ohm-cm

3.E+13 3.E+14

 

Features/Benefits

  • Improve strength, robustness, and elongation
  • Chemical resistance, moisture absorption has little effect on properties
  • Excellent heat distortion point and heat stabilization
  • Size stabilizer (prevention of warp)
  • Apply to the process of extrusion and ejection
  • Apply on the surface or casing of the board as the heat conductor

 

Package

25 KG/bag

11 MT/(20′)   

21 MT/(40′)