The Testing Result of GO YEN High-Effective Electronics Grade Heat Conductive Additive Using In World Renowned E-Factory

Description

Intro

GO YEN CHEMICAL INDUSTRIAL CO., LTD. (GYC Group) Technology Development Department have found that normally the mental material has well heat conductivity and can be applied on electronics printed circuit board, cooler, heat exchange material, waste heat recycling, brake component etc. , However as the product is required light, thin, short, beautiful features, metal material is too heavy and hinders the light weight of product. Besides, metal material also has destructive disadvantages such as poor corrosion resistance, easy rust situation, hard to mold, especially the color translation problem of mental material or powder, these shortcomings huge limit the application for mental material.
In contrast, general engineering plastic even if plastic alloy and thermosetting resin such as epoxy resin, phenolic resin etc., Polymer has well corrosion resistance and mechanical properties. As we call plastic heat conduction material means with higher heat conductivity, the general index is around 1W/(m. K). However, plastic heat conduction material still has some defects, the HDPE is a better heat conduction material still meets 0.44 W/(m. K) heat conductivity. The situation also restricts the application for plastic.
To solve disadvantages of two materials, GYC especially designed new high effective electronics grade heat conductive additive, the additive can be added to thermosetting resin (such as phenolic resin, epoxy resin), thermal film, thermal plastic substrate and also enhances the adding values of aluminum plate, copper substrate, and then used in electronic packaging materials, LED lighting materials, automotive electronics, computer equipment, power supply, communications, electronics equipment, semiconductor insulated panels, electronic chassis … and other areas.
The following was a world-renowned Metal Core PCB manufacturers which used GYC heat conductive additive, processed “laser scattering particle size distribution analysis” test .
The formula of GYC high-effective electronic grade heat conductive additive is applied to thermosetting resin

GYC heat conductive additive has a fine particle size and well dispersibility, the following was a world-renowned Metal Core PCB manufacturers which used GYC heat conductive additive, processed “laser scattering particle size distribution analysis” test 

The formula of GYC high-effective heat conductive additive which is used to thermosetting      resin(phenolic resin, epoxy resin)